Hybrid assembly consists of attaching components onto a screened substrate and sealing the substrate into a package. The hybrid assembly process may include surface mount, die attachment, wire bonding, and packaging. Functional testing is performed both prior to sealing and post sealing into package. Environmental testing is performed post sealing.
MPT is committed to excellent quality, customer service, product and process innovation. MPT provides quick turn-around for prototypes and in-time production. MPT has clean areas of Class 100 for pre-cap inspection and class 10,000 for assembly.
Applications
MPT hybrids have been used in:
- Signal Conditioning Systems
- Communications Equipment
- Radar Equipment
- Positioning Systems
- Avionics
- Navigation Systems
- Data Conversion
- Computer Systems
- Frequency Agile Systems
- & More
Why Micro-Precision Technologies
- Small Lot Friendly
- New Product Introduction (NPI)
- Consigned or Full Turnkey Assemblies
- Class 10,000 Cleanroom for Assembly (0.5 micron per cubic foot)
- Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
- AS9100D ISO-9001:2015 Certified
- MIL-PRF-38534 Class H Qualified
- QML-38534 Listed
Download Documents (PDFs)
Capabilities Brochure
Talk To Our Engineers
- P: 603-893-7600
- E: [email protected]
- Below is our Quick Contact form. To send us a file, use our Quote form instead.
Certifications
MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.