• Metalization of thick film substrates to complete assembly and testing of HIC and MCM microcircuits.
• Clean rooms of class 1000 and class 100,000
• Thick Film capable of multilayers have done over 24 layers
• Thick film is capable of super fine line of 2 – 3 MILS
• Thick film via through, via filled and a wrap-around.
• Laser trimming, active and passive.
• Manufacture analog and digital HIC and MCM
• Frequency ranges from DC to RF to MICROWAVE
• Packaging Flat-package, DIP, SIP and specialized packages.
• Technology is chip-and-wire, chip on board and SMT.

Manufacturing

• Quick turnaround of engineering models and prototypes.
• Production of 5,000 – 10,000 units per month of HIC or MCM
• High volume pick and place equipment.
• MPT has large capacity, high throughput, thick film metalization systems.
• Automatic wire bonding
• Automatic dicing saw for volume production

Testing

• MIL-STD-883 screening and testing
• Automated and computerized functional testings.
• Specialized functional test fixtures
• Analog, Digital, RF testing (up to 3GHz)

SUBSTRATE MANUFACTURE

• Printing ……………………………………………………………………………….….AMI 885

• Drying…………………………………………………………………………………….Vitronics IR Oven

• Drying…………………………………………………………………………………….Blue M Oven

• Firing……………………………………………………………………………………...BTU

• Laser Trim…………………………………………………………………………….…..ES144

• Via Filler…………………………………………………………………………………..PTC VF-1000

• Dicing Saw………………………………………………………………………………Disco

• Mask Aligner ……………………………………………………………………………HTG

• Photoresist Spinner……………………………………………………………………..Solitec

• Wet Etching……………………………………………………………………………..CCCL

• Gold Plating ……………………………………………………………………………Technic

• Film Thickness……………………………………………………………………………Tecor

ASSEMBLY

• SMD……………………………………..……………….…………..Quad IVC Automatic Placement

• SMD……………………………………………..……..………………..….MCT 6820 Reflow Conveyer

• Chip & Wire………………………….…………..……..K&S Automatic Wire Bonder (1419 & 1470)

• Chip & Wire……………………………………...…..MEI/Mechel Wire Bonders (827, 909 & 1204B)

• Chip & Wire……………………………………...……………………..……………….…..Blue M Ovens

• Package Sealing………………………………………………………………………….…..Benchmark

TESTING

• Functional………………………….…….Wide varieties of IEEE test equipment, such as

QUALITY ASSURANCE

• MPT is MIL-PRF-38534 qualified, QML-38534 listed and ISO9001 certified.