MPT supplies metalized thick film substrates; provides complete assembly, functional and environmental testing for microcircuits on thick film and thin film substrates. Thick film capabilities include multilayers of conductors, as well as super fine line/spacing up to 1-2 mils, via through, via filled and wrap-around. Laser trimming capabilities include passive and active trimming. MPT has clean areas of class 1000 for pre-cap inspection and class 100,000 for assembly. Military, Industrial and Commercial are all manufactured in this environment.

For the commercial marketplace MPT has developed superfine line on Ag and Au on thick film technology to replace some thin film substrates. This new process will allow many microcircuits now being done on thin film to be manufactured on thick film at a substantial cost savings to our customers. MPT has implemented automated assembly (pick & place) for die-mounting and wire bonding, as well as computerizing and automating many functional tests. These changes have led to lower product cost to our ever-expanding customer base.