A More Robust Alternative to PCBs
Thick film hybrids are a more robust alternative to Printed Circuit Boards (PCB). In many cases, a thick film hybrid can replace the PCB to function in environmentally adverse conditions. Thick film hybrids can operate in extreme heat, underwater, and in many other conditions in which a PCB cannot function.
Why Thick Film?
Circuitry screened onto ceramic substrates are a robust, compact & economical option for higher thermal efficiency.
Ceramic substrates can be screened in conductor layers, separated by dielectric layers, and connected by vias. Up to 10 conductor layers.
FR4 Conversions to Ceramics
Converting circuits to ceramic substrates can result in more efficient thermal management.