Hybrid Assembly

A More Robust Alternative

Thick film hybrids are a more robust alternative to Printed Circuit Boards (PCB). In many cases, a thick film hybrid can replace the PCB to function in environmentally adverse conditions. Thick film hybrids can operate in many harsh environments where traditional PC boards fail, such as extreme heat, high vibration, downhole mining, deep sea wells and space.

Inherent Thermal Management

Ceramic substrates such as alumina, aluminum nitride, and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently, dissipating it over the whole surface. PCB material (FR-4) is epoxy based with poor thermal conductivity, leading to hot spots which reduce the life of most semiconductor junctions.

Typical thermal conductivities of ceramics and FR-4 are:

Material (W/m-K)
Alumina 28–35
Aluminum Nitride 140–180
Beryllium Oxide 170–280
FR-4 0.8–1.1

Solutions

Thick Film

Circuitry screened onto ceramic substrates are a robust, compact & economical option for higher thermal efficiency. Ceramic substrates can be screened in conductor layers, separated by dielectric layers, and connected by vias.

Learn More

FR4 Conversions

Conversion of single-board computer assembly on FR-4 to MPT ceramic engineered substrate for your product/designs that require more efficient thermal management.

Learn More

Hybrid Assembly

MPT hybrid assembly capabilities include manual and automated surface-mount technology (SMT), wire-bonding and die attach. Assembled in class 10,000 clean room.

Learn More

Die Attach & Wire Bonding

MPT has both manual and automated wire-bonding and die-attach capabilities. These include ball and wedge bonding, auto die attach and auto dispense for epoxy, encapsulate or optical fluid.

Learn More

Semiconductor Packaging

We can repackage a standard or customized die into a different package which may improve the thermal performance, pinout configuration, electrical performance, or mechanical size and shape.

Learn More

Component Testing

Our extensive test program library offers capabilities for AC, DC parametric and functional evaluation and testing of a wide array of devices, ranging from diodes and transistors to more complex technologies.

Learn More

Certifications

MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.